简体中文 
UltraFast Die-Planar
Home    >   Products    >   Wafer and Dice    >   UltraFast Die-Planar

UF1751200100

Product Characteristics
Part Number:UF1751200100
Family:UltraFast Die-Planar
Chip Size (mil):175
VRWM(V):1200
IF(A):30
IFSM Max.(A):250
VF Max. @IF (V):2.25
VF Max. @IF,125°C(V):1.6③
IR Max. @VRWM (μA):200
IR Max. @VRWM 125°C (mA):3
TJ Max.(℃):150
Trr Max. (ns):100
Data Sheet
Spice Model
Package & Packing
Home   |  About Us  |  Products  |  Applications  |  News  |  Quality  |  Contact Us
2012-2018 © Sangdest Microelectronics Co. LTD
Website Development and Hosting by Nanjingguangmang